| abstract |
Provided are a temporary adhesive for manufacturing semiconductor devices, an adhesive support using the same, and a method for manufacturing semiconductor devices wherein the temporary adhesive (11) for manufacturing semiconductor devices, which contains (A) radical polymerization monomer or oligomer having fluorine atoms or silicon atoms, (B) high molecular compounds and (C) radical polymerization initiator, can provide an excellent application property, reduce a problem that when a member to be processed (such as a semiconductor wafer) (60) is mechanically or chemically processed, an adhesive generates a gas also in a temporary supporting under a high temperature condition, and further readily release the temporary supporting of the processed member without damaging the processed member even after the process at the high temperature. |