| abstract |
A power semiconductor module is able to have a good balance between cooling performance and long-term reliability by having a configuration wherein: the surface of a bonding wire and a surface of a power semiconductor chip that is mounted within the power semiconductor module, said surface not facing a wiring thin film, are encapsulated by an encapsulation resin (A) that does not contain a thermally conductive filler; and the encapsulation resin (A) is encapsulated by an encapsulation resin (B) that contains a thermally conductive filler. |