http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014082769-A1

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filingDate 2013-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eafd5a86caaa12199a99478323a7f75
publicationDate 2014-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2014082769-A1
titleOfInvention Bonding means for bonding at least two components using a sintering process
abstract The present invention relates to a bonding means (10) for bonding at least two components using a sintering process, having an inert carrier structure (12) and a sinter base material (14), wherein the carrier structure (12) forms a carrier layer (13) and wherein a layer (16, 18) of the sinter base material (14) is arranged on two opposing sides of the carrier layer (13). The above-described bonding means (10) enables a particularly reproducible sintering process, in which damage to the components to be joined is also reduced or prevented completely. Furthermore, the sintering process can be performed particularly cost-effectively and can lead to particularly stable bonds. The present invention further relates to a method for producing a bonding means (10), a method for bonding at least two components and the usage of the bonding means (10).
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