| abstract |
The present invention can provide a resin composition, a laminate, a method for producing a laminate, and a method for producing a flexible device, whereby sufficient adhesion is achieved between a resin layer and an inorganic substrate during the course of producing a flexible device, and only the inorganic substrate can be easily peeled off from the resin layer in the final stage. Further, the present invention can provide a substrate for flexible devices and a flexible device using said substrate, wherein variations in film thickness are small and the device is less prone to malfunction when the device is constructed. |