| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5231c81de1a546c1d6a9325c10910ce |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8314 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 |
| filingDate |
2013-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99bc74dced5b0f0673e04746af2b4b5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d2812775de5d50056d9cedbe420224f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10da3040cacf57bff775325c7691196d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c0c86db6599f3424fde2c6dff2f3e91
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40d46568f73e23433c518cb5b7d7d285 |
| publicationDate |
2014-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2014070534-A2 |
| titleOfInvention |
Integrated bondline spacers for wafer level packaged circuit devices |
| abstract |
A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019208072-A |
| priorityDate |
2012-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |