| abstract |
The present invention relates to a cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same. The cyanate ester resin composition contains cyanate ester resin, halogen-free epoxy resin, and an inorganic filler, the structural formula of the cyanate ester resin being as formula (I), wherein n is an integer from 1 to 50. The cyanate ester resin composition of the present invention has desirable heat resistance and fire resistance. Without using the halogen compound or phosphorus compound as the fire retardant, the prepreg, laminate, and metal-clad laminate that are fabricated by using the cyanate ester resin composition also have desirable fire resistance and have low coefficient of X/Y-direction thermal expansion, and therefore can be used to fabricate the substrate of a high-density printed circuit board. |