http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014042491-A1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_964715652eb394808baf941c5b3eb33a |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F7-1804 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-306 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F7-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F7-10 |
filingDate | 2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b15efa7e7addb2da308a261698628d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_457b0e2121fe9d068c3220dffecec73b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_407e55d66875472b7268b57bb7459d6b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d488162fe8d8b4addbfcb5fb036d8b9b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75dd9c61e421a6699ac44f2745bd0452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_782406ec93bb24067bf6b28cc2420e5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a50e018e9485341e29488cf51eff2f97 |
publicationDate | 2014-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-2014042491-A1 |
titleOfInvention | Epoxy compound having alkoxysilyl group, method for preparing same, composition comprising same, cured product made therefrom, and use thereof |
abstract | The present invention relates to an alkoxysilyl-based epoxy compound which exhibits excellent heat resistance characteristics, more particularly, a low coefficient of thermal expansion (CTE) and a high glass transition temperature in a composite, and/or which exhibits excellent flame retardancy in a cured product, and which eliminates the necessity of a separate silane coupling agent. The present invention also relates to a method for preparing the compound, and to a composition and cured product comprising the compound. According to the present invention, provided are: an alkoxysilyl-based epoxy compound having at least one alkoxysilyl group and at least two epoxy groups; a method for preparing the alkoxysilyl-based epoxy compound by means of the ring-opening of the epoxy of a starting material and alkoxysilylation; an epoxy composition comprising the epoxy compound; and a cured product made therefrom and the use thereof. The efficiency of the chemical bonding of the cured product, which is a composite of the composition comprising a novel alkoxysilyl-based epoxy compound according to the present invention, is improved when a composite is formed not only by chemical bonding between an alkoxysilyl group of the epoxy compound and a filler, but also by chemical bonding between alkoxysilyl groups of the epoxy compound having the alkoxysilyl groups. Accordingly, the compound of the present invention exhibits excellent heat resistance characteristics, such as a low CTE and a high glass transition temperature in a composite, and/or exhibits excellent flame retardancy in a cured product. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10738065-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015133840-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106232608-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106232608-B |
priorityDate | 2012-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 224.