http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014014811-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f1c856e5c7da6cb1e1c917320a6fe34 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2013-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0588c279d8b0f7da4d82d0ef2d4537c6 |
| publicationDate | 2014-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2014014811-A1 |
| titleOfInvention | Method of processing a device substrate |
| abstract | Methods of processing a device substrate (200) are disclosed herein. In one embodiment, a method of processing a device substrate (200) can include bonding a first surface (206) of a device substrate (200) to a carrier (302) with a polymeric material (300). The device substrate (200) may have a plurality of first openings (210) extending from the first surface (206) towards a second surface (208) of the device substrate (200) opposite from the first surface (206). Then, material can be removed at the second surface (208) of the device substrate (200), wherein at least some of the first openings (210) communicate with the second surface (208) at least one of before or after performing the removal of the material. Then, at least a portion of the polymeric material (300) disposed between the first surface (206) and the carrier substrate (302) can be exposed to a substance through at least some first openings (210) to debond the device substrate (200) from the carrier substrate (302). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I797287-B |
| priorityDate | 2012-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.