| abstract |
Provided is a laminate for circuit boards, which comprises a metal substrate, an insulating layer that is provided on at least one surface of the metal substrate, and a metal foil that is provided on the insulating layer. This laminate for circuit boards is characterized in that the insulating layer contains an inorganic filler and a crosslinked copolymer of a bisphenol type cyanate resin and a novolac type cyanate resin. |