| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2013-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_449ebdd539c8045addd5fc2009a07c5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e754812d1455c47c637d13a34d029ead
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a9e24a362fd5053d9c1c2ef6a7fe594
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffdee5505a5475e89fe7ebd800f96845 |
| publicationDate |
2014-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2014002529-A1 |
| titleOfInvention |
Circuit board, method for forming conductive film, and adhesion improver |
| abstract |
To improve adhesion of a conductive film to a base, said conductive film being formed by subjecting a coating film that is formed of fine copper particles to optical firing.nA circuit board (1) is provided with: a circuit that has a conductive film (2); and a substrate (3). The circuit board (1) is also provided with a resin layer (4) between the substrate (3) and the conductive film (2). The substrate (3) is formed of a base (31) that is not thermoplastic. The resin layer (4) contains a thermoplastic resin. The conductive film (2) is formed by subjecting a coating film, which is formed of fine copper particles (21), to optical firing. Consequently, adhesion of the conductive film (2) to the base (31) is improved by means of the resin layer (4). |
| priorityDate |
2012-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |