| abstract |
The present invention relates to an electroconductive paste useful in the manufacture of silicon solar cells and solar cell modules, especially for the backside of the silicon wafer. The electroconductive paste comprises metallic particles, glass frit, organic vehicle, and an adhesion enhancer. The adhesion enhancer comprises a metal or a metal oxide, or any other metal compound that will convert to metal or metal oxide at firing temperature. The adhesion enhancer comprises at least one metal selected from the group consisting of tellurium, tungsten, molybdenum, vanadium, nickel, antimony, magnesium, zirconium, silver, cobalt, cerium, and zinc, or oxides thereof. |