| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d527f9a5c3e991a1797de3518a88d14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2853 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R31-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bed8be3876468c6b4fb88c481eba7e82 |
| publicationDate |
2013-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2013176128-A1 |
| titleOfInvention |
Test carrier, ok/ng determination device, and ok/ng determination method |
| abstract |
A test carrier (10) temporarily housing a die (90) and comprising: a first wiring pattern (42) electrically connecting an external terminal (44) for the test carrier (10) and through-silicon vias (TSVs) (92) provided in the die; and a second wiring pattern (81) electrically connecting the TSVs (92). |
| priorityDate |
2012-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |