| abstract |
[Problem] Provided is a plating method whereby adhesion to a substrate can be improved.n[Solution] This plating method for plating a substrate is provided with: a step of forming a vacuum deposition layer (2A) on a substrate (2) by performing vacuum deposition with respect to the substrate (2); a step of sequentially providing an adhesive layer (21) and a catalyst adsorbing layer (22) on the vacuum deposition layer (2A) on the substrate (2); and a step of forming, on the catalyst adsorbing layer (22) on the substrate (2), a plating layer laminated body (23) having a first plating layer (23a) and a second plating layer (23b), which function as barrier films. The surface of the substrate (2) can be smoothed by means of the vacuum deposition layer (2A), and the vacuum deposition layer (2A) functions as a base layer that improves adhesion. |