| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-285 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
2013-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_078bd78bc52b4503bef08cb34095e7f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c11e02ebb09e022c9e940a831d2fe362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_475ae0272d54e0e98e3747d7816695d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb82223993757e8ab1cf204d4aea3406
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_798600bc5fdd55753c1053f5bfdf6114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1294469d1b52573e0885beaa3e426a4 |
| publicationDate |
2013-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2013143961-A1 |
| titleOfInvention |
Method for promoting adhesion between dielectric substrates and metal layers |
| abstract |
The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018502453-A |
| priorityDate |
2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |