| abstract |
Provided is a polyene-polythiol resin composition with outstanding heat resistance. A resin composition containing: (A) a silsesquioxane derivative represented by formula [1] below, having a random structure, and having two or more carbon-carbon unsaturated bonds per molecule; (B) a polythiol; and (C) a photoradical polymerization initiator. General formula [1] (R 0 -SiO 3/2 ) m (in the formula, R 0 has one or more functional groups selected from a (meth)acryloyl groups, a vinyl group, a vinyl ether group, an allyl group and an allyl ether group. R 0 may be the same or different. Part of the (meth) acryloyl group, vinyl group, vinyl ether group, allyl group and allyl ether group may be substituted with a C1-6 alkyl group, a C1-6 alkoxy group, a C1-6 halogenated alkyl group, a phenyl group, or a halogen. m represents the degree of polymerisation.) |