| abstract |
Provided are a polyimide and polyimide film having excellent solution processability, transparency, high heat resistance, and a low thermal expansion coefficient. The invention makes it possible to produce a polyimide having excellent solution processability, transparency, high heat resistance, and a low thermal expansion coefficient by using a novel diamine characterized in having an amide group and a trifluoromethyl group. This polyimide can be utilized in electronic display equipment and various other electronic devices. |