| abstract |
A post chemical-mechanical-polishing (post-CMP) cleaning composition comprising: (A) at least one compound comprising at least one thiol (–SH), thioether (–SR 1 ) or thiocarbonyl (>C=S) group, wherein R 1 is alkyl, aryl, alkylaryl or arylalkyl, (B) at least one sugar alcohol which contains at least three hydroxyl (–OH) groups and does not comprise any carboxylic acid (–COOH) or carboxylate (–COO -) groups, and (C)an aqueous medium. |