| abstract |
Provided is a conductive film forming method, whereby a conductive film having a low electrical resistance can be formed on a base material using optical firing, even if heat resistance of the base material is low.nThis conductive film forming method is a method for forming a conductive film (2) on a base material (1), said method having a step of forming, on the base material, a film (3b) composed of copper fine particles (4), a step of optically firing the film (3b), and a step of plating the optically fired film (3c). Consequently, even if heat resistance of the base material (1) is low, the conductive film (2) can be formed on the base material (1) by reducing irradiation energy of light in optical firing. Since the conductive film (2) has a plating layer (21), electrical resistance thereof becomes low. |