http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013086775-A1

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publicationDate 2013-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2013086775-A1
titleOfInvention Chemical mechanical polishing slurry for metal and application thereof
abstract Disclosed are a chemical mechanical polishing slurry for copper and application thereof. The slurry comprises an abrasive particle, a complexing agent, an oxidant, a corrosion inhibitor and at least one of phosphate type surfactant. The use of the chemical mechanical polishing slurry can keep a high copper removal rate, and improve dishing dent and over polishing window of polished copper line. The slurry can improve the following detects such as few contaminants on the surface of the polished copper and no corrosion on it.
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priorityDate 2011-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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