http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013081842-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fd1e4193f0f5eb58621db6ec20566a5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0145 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00317 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate | 2012-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1aaf1f185cc8b7dc047bde40265a11d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4f38304c95b38c853e2d7edafc7ca14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c67287f94d4bd5aedfc21f5630e30ee |
| publicationDate | 2013-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2013081842-A2 |
| titleOfInvention | Encapsulated arrays of electromechanical systems devices |
| abstract | This disclosure provides systems, methods and apparatus for encapsulating electromechanical systems devices. In one aspect, large arrays of electromechanical systems devices can be encapsulated. In one aspect the encapsulation includes an encapsulation layer supported over the electromechanical systems devices by encapsulation layer supports. The encapsulation layer can also include a plurality of orifices. The orifices can be sealed such that the electromechanical systems devices below are not damaged. |
| priorityDate | 2011-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.