http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013081767-A1

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filingDate 2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4dc1e09982ef251d1e83a01607969c5
publicationDate 2013-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2013081767-A1
titleOfInvention Method of forming self -aligned contacts and local interconnects
abstract A semiconductor device fabrication process includes forming insulating mandrels over replacement metal gates on a semiconductor substrate with first gates (104) having sources and drains and at least one second gate (104') being isolated from the first gates. Mandrel spacers (124) are formed around each insulating mandrel. The mandrels and mandrel spacers include a first insulating material. A second insulating layer (126) of a second insulating material is formed over the transistor. One or more first trenches are formed to the sources and drains of the first gates by removing the second insulating material between the insulating mandrels. A second trench is formed to the second gate by removing portions of the first and second insulating materials above the second gate. The first trenches and the second trench are filled with conductive material to form first contacts (132) to the sources and drains of the first gates and a second contact (142) to the second gate.
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Total number of triples: 27.