| abstract |
A MEMS device (17) formed by a body (2); a cavity (25), extending above the body; mobile and fixed structures (18, 19) extending above the cavity and physically connected to the body via anchoring regions (16); and electrical-connection regions (10a, 10b, 10c), extending between the body (2) and the anchoring regions (16) and electrically connected to the mobile and fixed structures. The electrical-connection regions (10a, 10b, 10c) are formed by a conductive multilayer including a first semiconductor material layer (5), a composite layer (6) of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer (7). |