| abstract |
A sealing agent for a semiconductor light-emitting device including an isocyanurate compound represented by formula (1), wherein the sealing agent contains more than 70 wt% of the isocyanurate compound with respect to the total amount of organic curing component in the sealing agent. (In formula (1), R 1 , R 2 , and R 3 represent specific substituent groups. At least one among R 1 , R 2 , and R 3 is the acryloyl group. L a represents a C 1-4 alkylene group.) |