| abstract |
Provided is a novel surface-treated molybdenum compound powder; also provided are a prepreg, laminate, metal foil laminate, printed circuit board, and the like having a low thermal expansion coefficient in the direction of the surface and excellent drill processability, heat resistance, and flame retardancy. This surface-treated molybdenum compound powder is one where at least part of the surface is covered by an inorganic oxide, this being used as a filler. |