abstract |
The purpose of the present invention is to provide a sealant composition for an electronic device, that does not generate problems during work even when heated, in a mounting step for the electronic device. This invention pertains to the sealant composition for the electronic device, that includes a compound (a) having at least 2 (meth) acryloyl groups, and a nitroxide compound and/or a thiocarbonylthio compound (c). |