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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45edb5859756a881d1e5e905d0a95891
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publicationDate 2013-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2013025573-A2
titleOfInvention Solder bump bonding in semiconductor package using solder balls having high-temperature cores
abstract A semiconductor die is solder bump-bonded to a leadframe or circuit board using solder balls having cores made of a material with a melting temperature higher than the melting temperature of the solder to ensure that in the finished structure the die is parallel to the leadframe or circuit hoard.
priorityDate 2011-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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