| abstract |
A method for manufacturing a polyimide metal laminate, comprising: a step for forming a polyimide film in which at least both surfaces of the film are formed by a thermally adhesive polyimide layer (a); and a step for thermally compressing and bonding a metal layer to the two surfaces of the polyimide film, the method characterized in that, in the step for forming the polyimide film, a self-supporting film is formed from a polyamic acid (a) solution obtained by reacting a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1), after which the self-supporting film is heated and imidized at a maximum heating temperature of 440°C or less to form the polyimide layer (a). (In the formula, R 1 is a hydrogen atom, a C 1 -C 12 alkyl group, or an aryl group, and R2 is a hydrogen atom, a C 1 -C 12 alkyl group, or an aryl group.) |