http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013015951-A2

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filingDate 2012-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4bfc78d39977f518912a07872c3957d
publicationDate 2013-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2013015951-A2
titleOfInvention Wafer-level packaging for solid-state transducers and associated systems and methods
abstract Wafer-level packaging of solid-state transducers ("SSTs") is disclosed herein. A method in accordance with a particular embodiment includes forming a transducer structure having a first surface and a second surface opposite the first surface, and forming a plurality of separators that extend from at least the first surface of the transducer structure to beyond the second surface. The separators can demarcate lateral dimensions of individual SSTs. The method can further include forming a support substrate on the first surface of the transducer structure, and forming a plurality of discrete optical elements on the second surface of the transducer structure. The separators can form barriers between the discrete optical elements. The method can still further include dicing the SSTs along the separators. Associated SST devices and systems are also disclosed herein.
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priorityDate 2011-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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