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publicationDate 2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2012172414-A1
titleOfInvention Metal nanoparticle paste, bonding method, bonded element and electronic substrate
abstract A metal nanoparticle paste includes: metal nanoparticles; a phosphate dispersant that has a hydrophilic portion; and a polar solvent, wherein the content of the metal nanoparticles is higher than or equal to 70 percent by weight and lower than 100 percent by weight.
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