| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_988ba3b5c9fb4bc9c03700df1a9da58d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d4ada69388e0a1b68daaf536597c732
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c5c122fda621c56d366f3e73b8028a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2a1283dbd8be10d49428d1c707d7ebac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6726048ef08d247e0c1ea7982fc86e33 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V29-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2012-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1611811541d3d9a8313b8ffff4652438
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abb081783fe371ae6b0d45713d8ee097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ecf234cb01e761ec23d9346646dd74b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7de73507b7ebdda33934830af9a4843 |
| publicationDate |
2012-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2012128875-A1 |
| titleOfInvention |
Thermal management within an led assembly |
| abstract |
This invention is directed to a method for applying a thermal management composition between an LED mounted circuit board and a heat sink, comprising the steps of; (a) applying a deposit of a thermal management composition onto either a second surface of the LED mounted circuit board or onto a surface of a heat sink, through a deposition tool the deposition tool having at least one aperture (401) where the at least one aperture has a perimeter surrounded by sidewalls, where the sidewalls have heights, where the heights are reduced around at least a portion (402) of the perimeter of the apertures on the deposition tool as compared to the average height of the deposition tool and (b) securing the LED mounted circuit board and the heat sink. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10851220-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019112293-A1 |
| priorityDate |
2011-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |