| abstract |
The present invention relates to a curable composition and a use therefor. One example of the curable composition can exhibit high processability and workability. Also, the curable composition can exhibit a high refractive index. The composition has low water transmittance before or after curing, and has superior resistance to cracking, resistance to heat shock, adhesive property, and hardness. In addition, the composition does not cause color change, such as whitening, under high temperature or high humidity, and does not exhibit stickiness on the surface. One example of the curable composition can be used as an adhesive material or as an encapsulation material for semiconductor elements such as a LED, a CCD, a photo coupler, or a photovoltaic cell. |