| abstract |
An electronic device (1) is provided with a first glass substrate (2), a second glass substrate (3), and an electronic element part (4) provided between these glass substrates (2, 3). The electronic element part (4) provided between the first glass substrate (2) and the second glass substrate (3) is sealed by a sealing layer (9) formed from a molten adhesive layer of a glass material for sealing that has electromagnetic wave absorbing capabilities. Either or both of first and second glass substrates (2, 3) is formed from a chemically tempered glass having a surface compressive stress value of 900 MPa or less. |