abstract |
The present invention relates to a halogen-free flame-retardant resin composition and a use thereof. The halogen-free flame-retardant resin composition comprises the following components: a bifunctional or multifunctional halogen-free epoxy resin, a reactive polyphosphonate and a cyanate ester resin. The halogen-free flame-retardant resin composition is applied to a prepreg, and the prepreg comprises a substrate and the halogen-free flame-retardant resin composition that is attached to the substrate through impregnation and drying. The halogen-free flame-retardant resin composition is applied to a laminate for printing a circuit, and the laminate for printing a circuit comprises several laminated prepregs and a metal foil disposed on a single or two surfaces of the laminated prepregs, wherein each prepreg comprises a substrate and the halogen-free flame-retardant resin composition that is attached to the substrate through impregnation and drying. The halogen-free flame-retardant resin composition of the present invention has a high heat resistance, a flame resistance and a resistance to dip soldering, thus being applicable to fabrication of a resin sheet, a resin composite metal foil, a prepreg, a laminate, and a printed circuit board. |