Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d30e0ab081a526e95df952a8884443a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_718f3189c5491bfb30d06342b8c81b87 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4664 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1291 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
filingDate |
2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c4216630b82d5aa9e381294b07f821e |
publicationDate |
2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2012061008-A1 |
titleOfInvention |
High performance electrical circuit structure |
abstract |
A high performance electrical interconnect adapted to provide an interface between terminals on first and second circuit members. The electrical interconnect includes a first circuitry layer with a first surface and a second surface having a plurality of contact pads adapted to electrically coupled with the terminals on the first circuit member. At least one dielectric layer is printed on the first surface of the first circuitry layer. The dielectric layer includes a plurality recesses. A conductive material is deposited in at least a portion of the recesses to create circuit geometry electrically coupled with the first circuitry layer. A second circuitry layer includes a first surface a plurality of contact pads adapted to electrically couple with the terminals on the second circuit member and a second surface attached to the dielectric layers. The circuit geometry electrically couples the first circuitry layer to the second circuitry layer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9350093-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8618649-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8610265-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9093767-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9699906-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9054097-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8984748-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8981809-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8981568-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9930775-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8912812-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8988093-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9318862-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9613841-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9320144-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8987886-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10159154-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2589329-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2589329-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9689897-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9277654-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9603249-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9276339-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9559447-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9196980-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9276336-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9076884-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9755335-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10506722-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8789272-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8970031-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10609819-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8803539-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8955216-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8955215-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10667410-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9660368-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9414500-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9761520-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9136196-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9320133-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8525346-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10453789-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9184145-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9184527-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8758067-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9536815-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9231328-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9232654-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9350124-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8928344-B2 |
priorityDate |
2010-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |