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filingDate 2011-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2012-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2012045949-A1
titleOfInvention Method for providing electrical connection(s) in an encapsulated organic light-emitting diode device, and such an oled device
abstract The invention relates to a method for manufacturing an encapsulated OLED device (100), comprising, after the encapsulation of the device: a step of ultrasonic soldering at a first edge of the lower electrode so as to form a lower electrical connection area from the encapsulation surface up to at least the surface of the lower electrode (2) by means of a solder pad (Q1); and/or a step of ultrasonic soldering in an upper electrical connection area from the encapsulation surface up to at least the surface of the upper electrode (4) by means of a solder pad (62). The invention also relates to such an OLED device.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113183566-A
priorityDate 2010-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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