| abstract |
The present invention addresses the problem of providing a photosensitive resin composition: which has excellent storage ability after being stored for a long period of type; exerts excellent micromachining performance, developability, low-temperature curability, flexibility as a cured film, electrical insulation reliability, solder heat resistance, organic solvent resistance, and flame retardancy; and in which a substrate has little warpage after being cured. The abovementioned problem can be solved by using a photosensitive resin composition production kit containing two or more of agent A and agent B, wherein agent A contains a compound (A) having a carboxyl group, and agent B contains a compound (B) having a reactive group which reacts with a carboxyl group, an oxime ester photopolymerization initiator (C), and a compound (D) having a photosensitive group and not having a carboxyl group. |