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publicationDate 2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2012040245-A2
titleOfInvention Through silicon via with reduced shunt capacitance
abstract This document refers to apparatus and methods for a device layer of a microelectromechanical system (MEMS) sensor having vias with reduced shunt capacitance. In an example, a device layer can include a substrate having a pair of trenches separated in a horizontal direction by a portion of the substrate, wherein each trench of the pair of trenches includes first and second vertical layers including dielectric, the first and second vertical layers separated by a third vertical layer including polysilicon.
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