Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ba7b9236c1d35929e8435dee0a0cb5e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2cdf7fc287e0b226df06edfbaaf05585 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6b16fb43a831e0216a3ea7ab47739e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20a21ea09de93a1eb88e3995c2a23df9 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D177-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-291 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
2011-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a985eded0aae1ba25dfe05cbbf52861 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ac90b258c82356d349948050bc8e811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1887894951c12d846a8f05dbf9c592d1 |
publicationDate |
2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2012039436-A1 |
titleOfInvention |
Film sealant and sealing method |
abstract |
Provided is a film sealant that is effective in ensuring a close seal of electronic devices at low temperatures. Also provided is a sealing method using this sealant. At least part of a device is covered with a film-form sealant containing a copolymer polyamide resin; then the sealant is hot-melted then cooled, thereby covering and sealing the device. The melting point or softening point of the copolymer polyamide resin falls within the range of 75 to 160°C, and the resin may have crystalline properties. The copolymer polyamide resin may be a multi-component copolymer, or contain units derived from long-chain components having an C 8-16 aklyene group (C 9-17 lactam and amino C 9-17 alkane carboxylic acid, etc.). The film sealant may cover only one surface of a device. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015098647-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015033785-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105849220-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105849220-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015098647-A1 |
priorityDate |
2010-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |