| abstract |
The present invention provides a semiconductor device production method, and a rinse used in the production method, the method comprising the sequential steps of: a sealing composition adding step of adding a semiconductor sealing composition and forming a semiconductor sealing layer on at least one part of a surface of a semiconductor, the composition containing a weight-average molecular weight of 2000 to 600000 of resin having a cationic functional group, and an amount of sodium and potassium being 10 ppb by mass or less at the respective element standard; and a washing step of washing the surface, on which the semiconductor sealing layer of the semiconductor substrate is formed, in a rinse with a pH of 6 or less at 25 °C. |