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filingDate 2011-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e9048405e7d9a4f3a64803c52284401
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publicationDate 2012-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2012026413-A1
titleOfInvention Polyamide resin composition used for reflective plate for surface mount led
abstract Disclosed is a polyamide resin composition used for a reflective plate for a surface mount LED, which contains: a copolymerized polyamide resin (A) that contains 50% by mole or more of a constituent unit obtained from an equimolar salt of terephthalic acid and a diamine having 2-8 carbon atoms and satisfies the conditions (a) and (b) described below; titanium oxide (B); at least one reinforcing material (C) that is selected from the group consisting of fibrous reinforcing materials and needle-like reinforcing materials; and a non-fibrous or non-needle-like filler (D). The polyamide resin composition is characterized by satisfying the condition (c) described below.n(a) 7.5 ≤ number of carbon atoms in copolymerized polyamide resin/number of amide bonds in copolymerized polyamide resin ≤ 8.2n(b) 0.27 ≤ number of carbon atoms on aromatic rings in copolymerized polyamide resin/total number of carbon atoms in copolymerized polyamide resin ≤ 0.35n(c) The lowest DSC melting peak temperature assigned to the copolymerized polyamide resin (A) in polyamide resin composition is 300-340˚C.
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priorityDate 2010-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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