| abstract |
Provided is a curable resin composition exhibiting an optical property, heat resistance and high moldability. The curable resin composition comprises a polymer (A), which is obtained by subjecting a monofunctional epoxy compound to epoxy-ring opening polymerization and has a polymerizable unsaturated bond group in the side chain thereof, and a compound having a polymerizable unsaturated bond group, and has an alicyclic structure in the polymer (A) and/or the compound having a polymerizable unsaturated bond group. |