| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5ca4ea54de3f7f2665585c71fd3e774 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2011-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_201fc7fbb45fba64d4da6fb962d7a681 |
| publicationDate |
2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2012017816-A1 |
| titleOfInvention |
Novel phenol resin, curable resin composition, cured article thereof, and printed wiring board |
| abstract |
Provided are: a phenol resin which gives a cured article having excellent heat resistance and a low coefficient of thermal expansion; a curable resin composition which comprises the phenol resin as a curing agent for an epoxy resin; a cured article of the curable resin composition; and a printed wiring board which has excellent heat resistance and low thermal expandability. A novel phenol resin having a resin structure in which a naphthol skeleton (n) obtained by the oxidation of a polycondensation product (a) of a naphthol compound and formaldehyde and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019082698-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7289103-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014208132-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019082698-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014037474-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014037473-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11414528-B2 |
| priorityDate |
2010-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |