| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62d09a12254db32ce47c77491dd59cc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_09af5f5c9c2c3e3c7afa7828dc28acc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_30c9920fec6e8b6257301b3369611749
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b9b70267cae5fc08d56180907be752a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7c4555914d811b56297e91ec9e2abdf9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2310-0481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B2210-009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G45-1207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f33dceed9d634dba8a59d8787e9b1d09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f8170df7d31f01f559f9412fefe9e7a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dafe6a578eeeb3d91c8a476c3233a13f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d34e09e7d840528e32d71f421679be7 |
| publicationDate |
2012-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2012005723-A1 |
| titleOfInvention |
Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards |
| abstract |
Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB' s), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9795040-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3704941-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3413710-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9345149-B2 |
| priorityDate |
2010-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |