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filingDate 2011-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e3b9e5006c42103fb5fb38ead78fdad
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publicationDate 2011-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2011148620-A1
titleOfInvention Sheet-like resin composition, circuit component using the sheet-like resin composition, method for sealing electronic component, method for connecting electronic component, method for affixing electronic component, composite sheet, electronic component using the composite sheet, electronic device, and method for producing composite sheet
abstract Disclosed is a sheet-like resin composition which contains, as essential ingredients, (A) a liquid bisphenol type epoxy resin, (B) a solid polyfunctional epoxy resin having a softening point of 70˚C or less and (C) a curing agent for epoxy resins. The sheet-like resin composition is characterized in that the (A)/(B) mass ratio is from 10/90 to 30/70.
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Total number of triples: 46.