| abstract |
Provided are an electronic component to be embedded in a substrate, and a component embedded substrate, wherein the thickness is reduced, so that a contribution to reduction of the size and weight of electronic equipment is made. An electronic component (100) to be embedded in a substrate is configured so that planar coils (110, 111) protected by insulators (103-105) are sandwiched by a pair of magnetic layers (101, 102). Ports (106-109), or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers (101, 102), and the predetermined positions correspond to the positions opposite to terminal electrodes (112-115) of the planar coils (110, 111). |