http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011140119-A2

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filingDate 2011-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2011140119-A2
titleOfInvention Flexible and moldable materials with bi-conductive surfaces
abstract A flexible, moldable material is provided with bi-conductive surfaces that can be fabricated using simple, cost-effective, and scalable deposition processes. The material is a composite structure composed of two conductive or semi-conductive sheets sandwiching a thin polymer insulator, all bonded together at their interfaces. The two functionalized sheets are made of conductive or semi-conductive particles dispersed through a flexible polymer. In one embodiment, a protective coating over the outer conductive sheets is applied to improve the durability of the composite structure. The material can be patterned into custom shapes and patterns with sizes ranging from meso-scale (millimeters) to macro-scale (meters) dimensions. The thicknesses of the components can also be tailored to be thin, such as a few hundred microns, yet the material maintains very good durability.
priorityDate 2010-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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