| abstract |
A high Tg cured product having a excellent low viscosity and excellent moisture resistance can be obtained by using an epoxy resin composition formed by combining a trimethylolpropane glycidyl ether as an essential component and is characterized in that the ratio of a triglycidyl body in the n = 0 component (a trimethylolpropane glycidyl ether monomer included in a trimethylolpropane polyglycidyl ether) in gas chromatographic analysis is at least 35%, the total amount of chlorine is no more than 0.3%, and the viscosity at 25°C is no more than 300 mPa·s. As a result, a cured product can be produced that has excellent heat resistance and moisture resistance sufficient for a normal range of use, and a resin composition is obtained that is useful in the sealing of electric and electronic components such as semiconductor elements, and as a coating material, laminated material, composite material, or the like, which is technically significant. |