| abstract |
Disclosed is a dilute alkali development-type photo-curable thermosetting resin composition which is suitable for use in obtaining a cured coating film which exhibits excellent adhesion with a substrate, chemical resistance, solder heat resistance, PCT resistance, thermal shock resistance, electroless gold plating resistance, electrical insulation properties, etcetera. The disclosed photo-curable thermosetting resin composition is characterised by comprising: a carboxyl group-containing resin, a photosensitive resin having a structure represented by general formulas (1)-(3), and a photopolymerization initiator. (In formula (1) R 1 represents the group represented by formula (2), R 2 represents a methyl group or an OR 1 group, n+m=1.5-6.0, n=0-6.0, m=0-6.0, 1=0-3, and n:m=100:0-0:100.) (In formula (2) R 3 represents hydrogen or a methyl group, R 4 represents hydrogen or the group represented by formula (3), and k=0.3-10.0) (In formula (3) R 5 represents hydrogen or a methyl group.) |