| abstract |
Disclosed is an electronic device which has enhanced reliability by improving the bonding strength between a glass substrate and a sealing layer in cases where local heat sealing such as laser sealing is employed.nSpecifically disclosed is an electronic device (1) which comprises a first glass substrate (2), a second glass substrate (3), and a sealing layer (8) for sealing an electronic element unit that is provided between the glass substrates (2, 3). The sealing layer (8) is composed of a layer that is obtained by locally heating and fusion bonding a sealing material that contains sealing glass, a low expansion filler and an electromagnetic wave absorbing material by an electromagnetic wave such as laser light or infrared light. A reaction layer (11) is formed inside the first and second glass substrates (2, 3), and the maximum depth of the reaction layer (11) from the interface with the sealing layer (8) is 30 nm or more. |