http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011114692-A1

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filingDate 2011-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85c8995cbad26c59087bf6dbcd8e209f
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publicationDate 2011-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2011114692-A1
titleOfInvention Resin composition sheet, and method for production thereof
abstract Disclosed is a resin composition sheet which enables the molding temperature to be lowered from the range of 260-280°C to the range of 200-250°C when using the resin composition sheet to manufacture product packaging such as a carrier tape, and which is less susceptible to visible defects from the transferral of the shape of a release film, even when heated to a relatively high temperature via the release film by means of a contact heater. Specifically disclosed is a resin composition sheet that includes a polycarbonate resin, an amorphous polyester resin, and a silicate compound filler. Such a resin composition sheet is suited for use in the manufacture of product packaging such as carrier tapes. When the resin composition sheet is used as product packaging for packaging objects that are vulnerable to static electricity, it is preferable to add a conductive filler to the resin composition sheet in order to prevent electrostatic buildup in the packaged product.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102030581-B1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013071318-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016098242-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014108867-A1
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priorityDate 2010-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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